Job Summary:
Project leader for Resilience, Subcon Consolidation, Dual Source Qual, low cost project & responsible for strategic program portfolio in mass production environment. Leading cross site-functional core team and accountable for project deliverables, through Change Control Board (CAB) and IATF 16949 requirements.
Related to Assembly Test Backend & WLCSP processes.
Responsibilities
- Lead transfer and consolidation projects across external manufacturing sites. Set clear milestones to support outsourcing strategies and supplier performance.
- Act as the main contact and owner of the project. Oversee schedules and deliverables, assign roles and responsibilities, and ensure timely execution.
- Guide the team through gap analysis, design checks, risk management, and follow-up actions. Aim for smooth qualification, robust processes, and timely integration.
- Work with teams like Commercial, Business Unit, Quality, and Supply Chain to define business cases, qualification plans, customer requirements, and strategies for equipment transfer and product phase-out.
- Manage project updates and reviews. Lead phase gate approvals and align with stakeholders.
Requirements:
- Bachelor's Degree in Engineering or equivalent technical background.
- Minimum 5 & best with 8 years of experience in semiconductor IC manufacturing environment, with hands on exposure from Wafer Bump Process, Assembly/ Test process & Packaging experiences.
- Knowledge and track records of cross site-functional program management, team leadership, technical writing with presentation, self driven and discipline.
- Certified PMP will be an added advantage.