Sustain and optimize the Wafer Saw (Die Preparation) process to achieve high performance in yield, quality, cycle time, and cost, while ensuring robust process control and supporting capacity expansion.
- Own and sustain Wafer Saw / Die Preparation processes.
- Define, optimize, and control sawing parameters (blade type, feed rate, spindle speed, etc.)
- Drive yield improvement, defect reduction, and process capability enhancement
- Lead failure analysis related to chipping, cracking, contamination, and die defects
- Establish and maintain SPC controls, FMEA, and control plans
- Support new product introduction (NPI) and process qualification
- Identify and implement cost reduction and productivity improvements
- Evaluate and qualify materials, tooling, and equipment suppliers
- Lead continuous improvement projects and capacity expansion initiatives
- Ensure complete and accurate process documentation and standardization
- Bachelor’s Degree in Engineering (ME, EE, IE or equivalent)
- Minimum of 3 years Process Engineering experience in semiconductor manufacturing with hands-on experience in Wafer Saw / Die Preparation
- Strong knowledge of Wafer Saw processes, materials, and defect mechanisms
- Understands DFD6240, DFD6340/1, DFD6361/2, ADT2000, Laser Groove and other die preparation equipment.
- Proficiency in SPC, DOE, Data Analysis, FMEA, Control Plan and Change Management
- Solid problem-solving and root cause analysis (RCA) skills
- Ability to manage multiple priorities in a high-volume environment
- Strong technical ownership and decision-making capability
- Effective cross-functional communication and collaboration
- Experience in different FOL processes is an advantage