Master Thesis - Experimental determination of fracture properties of deliberately weakened layers in silicon carbide (f/m/div)

Skip to main contentSystem update notice: From 22 July to 3 August, application processing will be delayed due to a system update.Job SearchMy ActivityProfileCareersFAQsBenefitsJoin Talent NetworkSign InEnglishSingle Position#WeAreInView All JobsFlexible LocationMaster Thesis - Experimental determination of fracture properties of deliberately weakened layers in silicon carbide (f/m/div)Villach (Austria)Apply NowSave JobFind out how well your profile matches this jobUpload your resumeJob descriptionBenefits and company informationJob IdHRC1724073Job FamilyResearch & DevelopmentType of EmploymentFull timeDuration of EmploymentTemporaryWorkplace TypeHybridJoin asStudent/Intern/Trainee#WeAreIn to create tiny chips and big careers. Are you ready to take the first step in your career? Let's shape the future together! Whether you join as a student, intern, or trainee, you'll be part of something real - real projects, real impact, and real opportunities to grow. Are you in?Your RoleKey responsibilities in your new roleTechniques: Gain exposure to fracture‑mechanical testing, scanning electron microscopy, and three‑dimensional (3D) surface mapping via white‑light interferometryApplication: Transfer experimental insights to structures relevant to sustainable, low‑waste wafering in the semiconductor domainCharacterization: Investigate how manufacturing parameters influence interface toughness and morphology to support data‑driven process optimizationCorrelation: Use and refine an existing testing workflow to produce robust mechanical datasets and correlate them with microscopy observationsFurther Information:Type of employment: Temporary / Full-time (flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.)Duration: 8 monthsYour ProfileQualifications and skills to help you succeedEducation: Enrolled in a Master in Materials Science, Physics or Mechanical EngineeringSample Prep and Testing: Experience in or strong motivation to learn about mechanical sample preparation and testingMicroscopy Techniques: Knowledge of or a strong willingness to learn microscopy methods including electron microscopyLanguage Skills: Ability to work and communicate well with our international team in English and/or GermanThis position is subject to the collective agreement for workers and employees in the electrical and electronics industry (full-time), employment group B for bachelor students, employment group D for master students (https://www.feei.at/wp-content/uploads/2026/06/minimum-salaries-white-collar-workers-2026-05-01.pdf).Please attach the following documents (German or English) to your application:Motivation letterCVCertificate of matriculation at a universityLatest Transcript of records (up-to-date)Highest completed educational certificate (Matura certificate for Bachelor students, Bachelor certificate for Master students)Reference letter (optional)Contact:    Ina Miklau#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.Learn more about our various contact channels.We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.Please let your recruiter know if they need to pay special attention to...