Senior IC Packaging Engineer

United States$120k–$261kPosted Jul 20, 2026
Senior IC Packaging Engineer | Microsoft Careers Skip to main content Microsoft Careers Careers Careers Search Search jobs Sign in Single PositionView All JobsSenior IC Packaging EngineerUnited States, Oregon, Hillsboro +4 moreApply nowAdd to cartFind out how well you match with this jobUpload your resumeJob descriptionCompany and benefitsJob number200043388Date postedJul 20, 2026Work site3 days / week in-officeTravelLess than 25%ProfessionHardware EngineeringDisciplineSilicon EngineeringRole typeIndividual ContributorEmployment typeFull-TimeOverviewMicrosoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing & Package Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Senior IC Packaging Engineer to join the team.#SCHIE #CSMEResponsibilitiesThe Senior IC Package Engineer will be responsible for providing expertise, insight, and support to the Silicon device development team through the entire life cycle of the product.  In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.Specific responsibilities to include:Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeoutDefine, design and develop test vehicles to validate Silicon, Package, System performance.Drive supplier assessments and manage suppliers through definition, development, qualification and production.Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.Define EDA tools requirements for advanced 3DIC packaging designsDesign and develop package and assembly drawings to support the manufacturing.Lead supplier assessments and manage suppliers through definition, development, qualification and production.Assess and characterize the reliability of Integrated Circuits (IC)...

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