Sample Preparation Associate II- Chip Assembly & Wire Bonding

Sample Preparation Associate II- Chip Assembly & Wire BondingD-Wave (NYSE: QBTS), D-Wave is a leader in the development and delivery of quantum computing systems, software, and services. It is the world’s first commercial supplier of quantum computers, and the first and only to offer dual-platform quantum computing products and services, spanning both annealing and gate-model quantum computing technologies. D-Wave’s mission is to help customers realize the value of quantum today through enterprise-grade systems available on-premises and via its Leap™ quantum cloud service, which offers 99.9% availability and uptime. More than 100 organizations across commercial, government, and research sectors trust D-Wave to address complex computational challenges using quantum computing. Learn more about realizing the value of quantum computing today and how D-Wave is shaping the quantum-driven industrial and societal advancements of tomorrow: www.dwavequantum.com. About the roleD-Wave is seeking a Sample Preparation Specialist (Chip Assembly & Wire Bonding) to join our Assembly, Integration and Test Engineering team. In this role, you will build and prepare chip samples for cryogenic testing, including mounting chips, wire bonding to PCB stacks, and soldering delicate connectors. You will work under a microscope, use precision tools, handle lab chemicals safely, and execute repeatable, production-style workflows.You will contribute to improving procedures for throughput, yield, and maintainability, while learning from senior team members and engineers. This is a hands-on, entry-to-mid-level role ideal for someone building professional expertise in microelectronics and precision assembly.While your primary focus is on sample preparation, you will also collaborate with Systems, Packaging, and Engineering teams to support experimental builds, troubleshooting, and process improvements.What you'll doMount chips to copper packages using approved adhesives, fixtures, and curing processesHand wire bond aluminum connections; operate manual and automated wire bonders as trainedMicro-solder fine-pitch PCB connectors and jumpers with precisionHandle, align, and secure parts under a microscope using tweezers, micromanipulators, and torque toolsClean samples with approved chemistries (e.g., IPA, acetone, flux removers) and ultrasonic baths as requiredSupport the handling and packaging of delicate samples for records, shipment, or failure analysisInspect work using microscope visual checks, continuity/resistance tests, basic bond pull/shear checks, and photo documentationRecord work accurately in travelers, lot and revision tracking, and rework logsSupport maintenance of tools, fixtures, and workstations in an organized and safe mannerCollaborate with Systems, Packaging, and Engineering teams on priorities, nonconformances, and design feedbackFollow established procedures consistently while learning to troubleshoot and optimize workflow stepsTake ownership of assigned tasks, escalate issues when necessary, and actively seek guidance to build technical knowledgeAbout You2+ years of demonstrated practical skills and applied technical knowledge; formal education (degree or technical diploma in engineering, physics, materials science or related field) is valued but not required2+ years of hands-on technical experience microelectronics, precision assembly, or related hands-on lab workProven dexterity and patience for precision, repetitive tasks under a microscopeExperience with micro-soldering and fine-pitch connectors; basic wire bonding experience or strong aptitude to learnSafe chemical handling practices, PPE use, and fume-hood operationAwareness of ESD-safe practices and careful part handlingStrong attention to detail, accurate record-keeping, and procedural disciplineAbility to collaborate effectively with teammates and communicate issues or suggestions clearlyEagerness to learn, take guidance, and grow technical capabilities in microelectronics and...