Change the world. Love your job.
Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments (TI) Systems Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment with exposure to a variety of state-of-the art applications each day.
Responsibilities may include:
- Define system architectures for high-power-density DC-DC converters, intermediate bus converters (IBCs), and HVDC power delivery solutions.
- Develop power system specifications, requirements, and validation plans.
- Lead topology evaluation, tradeoff analysis, and system optimization for efficiency, power density, cost, and reliability.
- Collaborate with IC design, magnetics, packaging, thermal, firmware, and applications teams.
- Perform modeling and simulation using tools such as SIMPLIS, SPICE, MATLAB, or equivalent.
- Analyze system performance including efficiency, transient response, EMI, thermal behavior, and fault protection.
- Engage directly with hyperscale and enterprise customers to understand future power requirements and translate them into product roadmaps.
- Support product bring-up, debugging, characterization, and customer deployments.
Minimum requirements:
- M.S. or Ph.D. in Electrical Engineering.
- Strong background in power electronics and power conversion architectures.
- Deep understanding of magnetics, resonant converters, switching converters, and power semiconductor devices.
- Experience with system modeling, simulation, and hardware validation.
- Strong analytical and problem-solving skills.
- Excellent communication and cross-functional collaboration abilities.
Preferred qualifications:
- Experience with LLC, DAB, CLLC, multiphase buck, or switched-capacitor converters.
- Knowledge of high-voltage power distribution (48V, 400V, 800V HVDC).
- Familiarity with AI server, GPU, telecom, or data center power architectures.
- Experience with planar magnetics, GaN devices, and advanced packaging technologies.
- Experience working directly with hyperscale customers.