Advanced Application Engineer – Automotive (German required)

The Advanced Application Engineer provides high‑level technical support and application expertise to automotive semiconductor customers, specializing in Advanced Driver Assistance Systems (ADAS) and Inverters. This role acts as a trusted technical partner throughout the automotive product lifecycle, from early architecture definition to design‑in, qualification, and high‑volume manufacturing of ADAS solutions.

The position prioritizes application enablement, system‑level problem solving, and accelerating customer adoption of advanced semiconductor materials and technologies tailored for ADAS requirements in the automotive industry. The AAE collaborates closely with customer design, process, and reliability teams—particularly those focused on automotive safety and sensor integration—as well as internal R&D, product management, quality, and sales to deliver robust, reliable ADAS solutions and foster long‑term customer relationships.

This role is located in Rumania and reports into the Technical Service Leader of the TAS Thermal and Assembly Solutions Business unit in Solstice. The TAS portfolio includes TIMS, Heat Spreaders, Advanced Packaging, and Display solutions, now adapted for automotive ADAS applications such as radar, lidar, and high‑performance vision systems used in both AI Edge Computing and AI Cloud Computing for vehicles.

Advanced Technical Support & Customer Engagement 

• Serve as the primary technical interface for automotive customers developing and integrating advanced semiconductor applications in ADAS systems.
• Provide expert‑level troubleshooting for complex ADAS application, process, or reliability issues—including sensor fusion, thermal management, and system safety—across development and production phases.
• Support customers during design reviews, process integration discussions, and root‑cause investigations for ADAS sensor modules, control units, and safety-critical electronics.
• Act as a peer engineer to automotive customer technical teams, contributing proactive solutions and industry best practices for ADAS system performance and reliability.

Application Engineering & Design‑In Support

• Translate customer requirements into clear technical specifications, test plans, and application recommendations.
• Support design‑in activities, including material selection, process window definition, and application validation.
• Provide simulation inputs, characterization data, and application notes to accelerate customer confidence and adoption.
• Help reduce re‑spins, late-stage changes, and re‑qualification cycles.

Qualification, Reliability & Validation

• Support customer qualification and reliability testing, including analysis of thermal, mechanical, electrical, or chemical performance.
• Interpret and communicate reliability data (e.g., thermal cycling, power cycling, HTOL, environmental stress) to customers and internal teams.

Cross‑Functional Collaboration

• Provide a feedback loop from customers to internal R&D and product development on unmet needs, gaps, and improvement opportunities.
• Collaborate with sales and business development to support technical evaluations, customer proposals, and design win activities—without carrying direct sales quotas.
• Contribute to internal training and enablement by sharing application learnings and best practices

Required Qualifications

Education

• Bachelor’s degree in electrical engineering, Materials Science, Chemical Engineering, Thermal Engineering, Physics, or a related technical field.
• Master’s degree is desirable but not required
• German is required, ideally native German 
• Available to travel 50% /year

Experience

• 5 + years of experience in semiconductor applications engineering, technical support, process engineering, or reliability engineering.
• Hands‑on experience working with IDMs, foundries, fabless companies, or Automotive OEMs or Tier 1
• Strong familiarity with semiconductor manufacturing flows and cross‑company collaboration models. 

Technical Skills

• Strong understanding of semiconductor devices, materials, packaging, or process integration 
• Experience with advanced packaging and integration concepts such as 2.5D/3D, chiplets, fan‑out, or system‑level considerations is a plus.
• Ability to analyze and communicate complex technical data and failure mechanisms.
• Comfortable working across development, qualification, and high‑volume manufacturing environments.

Soft Skills & Competencies

• Strong engineer‑to‑engineer communication skills with the ability to build technical credibility.
• Structured problem‑solving and root‑cause analysis mindset.
• Ability to manage multiple customer programs in parallel with minimal supervision.
• Comfortable presenting technical concepts to both deep technical and mixed technical/commercial audiences.

Travel & Work Environment

• Willingness to travel (typically 20–40%) to customer sites, fabs, or OEM locations as required.
• Hybrid work model depending on customer proximity and lab access needs.