FPD-Link Applications Engineer

Texas Instruments·Oracle Recruiting
Shanghai, China · Shenzhen, ChinaPosted Jun 17, 2026
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Change the world. Love your job. 
Texas Instruments (TI) is out front and ready for the next big challenge. Our innovations are at the core of nearly every electronics product in use today. And it doesn't stop there. We're developing breakthrough technology to power the world's future innovations as well. TI is committed to building a better future — from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. Put your talent to work with us.

Our business has very high growth in TI and is in a segment where the market is fast growing. We are looking for an experienced Applications Engineer who is passionate about collaborating with automotive and industrial customers on the next generation of camera, imaging, and display solutions. 

This role is responsible for application support for TI's FPD-Link SerDes products. 

Key responsibilities:

Customer Collaboration & System Integration

  • Work directly with Tier 1 and OEM engineering teams to architect and optimize IVI and ADAS end products
  • Provide SW & HW support to ensure robust and high performance automotive and industrial solutions
  • Conduct reviews for customer schematics, PCB layout, high‑speed routing, and system integration details
  • Support system bring‑up, on‑site debug, and in‑lab validation activities as needed
  • Develop application notes, design & debug guides, EVMs and reference designs
  • Create and maintain lab demos and evaluation platforms for customer design-in and trade shows 

Technical Support, Communication & Issue Resolution

  • Own customer escalations and root‑cause analysis across hardware, software, and system interactions
  • Support customer-requested test and data sets for automotive & industrial platform releases
  • Execute measurement and debug using oscilloscopes, logic analyzers, protocol tools, and test equipment 
  • Facilitate design‑in discussions across diverse engineering groups

Minimum requirements

  • Bachelor's degree in Electrical Engineering, ECE, or related field
  • 3+ years of relevant experience in high‑speed interfaces or automotive electronics
  • Strong technical background, with the ability to produce high quality technical documentation
  • Foundational understanding of FPD‑Link, SerDes protocols, or other high‑speed signaling architectures
  • Experience in customer-facing technical roles
  • Strong written and verbal communication skills
  • Solid hardware and software debugging skills


Preferred qualifications:

  • Experience with automotive Tier 1/OEM development cycles and production requirements
  • Familiarity with IVI, ADAS, autonomous driving sensors, and/or automotive camera ecosystems
  • Demonstrated strong analytical and problem solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Adaptability and resourcefulness in fast‑paced customer environments
  • Prior exposure to EMC/EMI debugging, compliance testing, and mitigating link‑level interference.
  • Demonstrated proficiency in scripting/automation for analysis or lab testing

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