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Texas Instruments (TI) is seeking a full-time Failure Analysis Engineer in Dallas, Texas to be responsible for technical functions in support of engineering activities such as characterization design, test, checkout, and modifications of assembly technologies. In this role, you will also work with die level failure analysis - circuit analysis as well as verify fail mode of die, isolate failure site and identify fail mechanism. The FA Engineer position provides the opportunity for interacting with wafer fab processing and assembly/test care-about while interfacing with Design Engineering, Product Engineering and CQE.
Additional responsibilities include:
- Circuit analysis, bench level equipment skills, die level deprocessing, and report writing;
- Ability to work from schematic diagrams, written and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions;
- Perform bench level electrical verification/fault isolation on integrated circuits to determine root cause of failure;
- Isolate failures for accurate identification of defect locations;
- Managing the failure analysis process in conjunction with their own skill set development; Work in a team environment and provide consultation for non-F/A disciplines;
- Write detailed failure analysis report.
Minimum Requirements:
- Master’s degree in Electrical Engineering and 2 years of experience in process integration, product development, or failure analysis in semiconductor manufacturing. OR
Bachelor’s degree in Electrical Engineering and 5 years of experience in process integration, product development, or failure analysis in semiconductor manufacturing.