PIM (Si Gel Filled) Power Module Development Engineer
Shenzhen, China · Suzhou, ChinaFull-timePosted Jun 17, 2026
- New package technology and platform module development (Si-gel filled module).
- Technical leadership on new power module technology and enabling technology for automotive/industrial application.
- Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
- Package/design review for new package development, on-tme release with the first pass success (qualification).
- Present technical finding, design review and recommendation to stakeholders and management.
- Lead package related failure analysis, reliability testing and debug package issues.
- Participate in customer meeting, provide technical clarification and support failure investigation.
- Define power module package strategy aligned with product roadmap.
- Own end-to-end package development from concept to qualification upon company's package development procedures.
- Ensure package reliability, performance, and manufacturability.
- Establish and optimize packaging processes and specifications.
- Collaborate with cross-functional teams (design, wafer fab, test, product engineering).
- Evaluate and introduce new packaging technologies and materials.
- Manage risk, cost, and schedule for packaging programs.
- Support customer engagement for technical discussions and issue resolution.
- Serve as subject matter expert (SME) for packaging within the organization.
- Minium Bachelor's degree of material science or mechanical engineering.
- More than 8 years of power module package development experience including transfer to the production.
- Preferred Si gel filled module package development experience with SiC device.
- Good statistical analysis skills with Minitab or JMP.
- Preferred the knowledge to use Auto CAD software
- Good communication skills with English.