Senior Flip Chip Manufacturing Process Engineer

Change the world. Love your job. 
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.

The responsibilities of a Manufacturing Process Engineer in this role include:

• Support manufacturing operations
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality. 
• Develop new automated die attach programs, optimize process parameters, and recipe standardization. 
• Support die attach processes for customer deliverable materials. (i.e. specialization for flip chip packages)
• Document die attach process details in specification(s) and work instructions
• Define applicable die attach materials for specific applications (flux, solder paste, bumps, etc.)
• Define statistical monitoring methods and automated monitoring methods supporting developed die attach processes
• Support reflow and flux wash processes for flip chip devices (i.e. recipe generation and production monitoring activities)
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support, process simplification and process system/data analysis automation. 
• Identify systematic problems in either process or equipment related sources, communicating findings to the engineering staff in a continuous manner, leading the team to find systemic actions and monitoring throughput. 
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Supervise and lead a team of process technicians.

Minimum requirements:

• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Minimum 5 years of relevant experiences in flip chip process
• Strong foundation in statistical process control, engineering change control and process release strategies.
• Strong foundation for data analytic applications and analysis. 

Preferred qualifications:

• Goal oriented self-starter with a sense of urgency.
• Strong verbal and written communication skills, ability to present projects and updates with confidence. 
• Ability to work in teams and collaborate effectively with people in different functions. 
• Strong time management skills and priority management that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships, not only with direct network within the area but also several support groups that enable the manufacturing line. 
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results with quality in mind. 
• Have basic knowledge in set-up and parameter optimization for ASM Die Bonder machines (ASM 8312+, ITEC ADAT)
• Have basic knowledge in set-up and recipe optimization for reflow and fluxwash process.
• Have knowledge in using statistical analysis tools (Excel, Minitab, Spotfire, JMP) will be an added advantage. 
• Have knowledge in Quality Tools (FTA, Fish Bone, etc.) and Problem-Solving documents (8D report, RCA, DMAIC) will be an added advantage. 
• Prior experience in handling flip chip die attach, reflow and flux wash process will be an added advantage.