• Previous experience in MOSFET technologies and SiC plus.
• Thorough understanding of semiconductor fabrication processes and device physics, product testing, performance and reliability.
• Strong self-motivated, initiative and integration mind.
• Good communication and presentation skills (Proficient at technical writing and presenting)
Roles & Responsibility
• Interface with the Product / Device Engineers & Business Units to drive quality initiatives and maintain best in class outgoing quality – jointly identify and drive wafer Fab, Assembly and Final test improvements.
• Identify/correct potential product marginalities and reduce potential product scrap/quality event.
• Take leadership role to establish relationships between multiple manufacturing sites and engineering departments to drive corrective actions tied to quality improvements.
• Analyze and deliver KPIs (Scrap, Cost and Quality) to ensure the PSG business objectives.
• Monitor, review and present regular quality performance data and metrics to stakeholders in a concise and clear way that enables data-driven decision-making.
• Participate in yield analysis, drive necessary improvement actions on silicon process, setting optimization, and testing robustness in order to improve yield to target
• Driving regular and special cross-functional team meetings towards consensus of PSG requirements
Qualification & Requirement
• BS or MS in Electrical Engineering or related technical field (example: Chemical, Mechanical, Physics)
• Minimum of 3 to 5 years of direct fab yield experience, Integration Engineer or product engineering
• Proven record of product engineering leadership resulting in quantifiable improvements in quality, yield, cost or process.
• Ability to identify, collect, analyze and present data necessary to resolve yield related issues based on silicon technical skills
• Ability to adapt to changes in the work environment, delays or unexpected events; manage competing demands; change approach or method to best fit the situation to ensure site success
Below skills and experiences are preferred
• Previous experience in MOSFET/IGBT technologies and SiC plus.
• Thorough understanding of semiconductor fabrication processes and device physics, product testing, performance and reliability.
• Strong self-motivated, initiative and integration mind.
• Good communication and presentation skills (Proficient at technical writing and presenting)