Advanced R&D Engr/Scientist

We are seeking a highly motivated and experienced Sr R&D Scientist to join our APAC R&D Team. In this role, you will be instrumental in driving the development of novel materials from concept to commercialization. You will lead projects focused on semiconductor back-end and packaging materials, from board-level to chip-level. The ideal candidate will combine deep technical expertise with a passion for creating new products, forging strategic external partnerships, and mentoring junior engineers. If you are an open-minded problem-solver who enjoys challenges and has a proven track record of successful product translation, we encourage you to apply.  

 

Key Responsibilities  

· Lead the development of innovative products for TIM and Packaging Materials for electronic customers. 

· Generate innovative ideas, design material formulations, and develop robust processes to realize product concepts.  

· Design experiments, analyze data, and troubleshoot complex material-related issues, including understanding failure modes in electronic packaging applications. 

· Closely working with cross function team (technology, sales, marketing, AE) to develop end-to-end solution, ensure successful market launch.  

· Proactively identify, evaluate, and establish strategic partnerships with external entities such as universities, research institutes, and startups, evaluate the technical capabilities and maturity. 

· Work independently to manage multiple projects, ensuring they meet technical, timeline, and budgetary goals. 

· Provide technical leadership within the R&D team, offering guidance and mentorship to junior engineers. 

 

Required Qualifications    

· Advanced degree (Master’s required, Ph.D. strongly preferred) in Materials Science, Chemistry, Polymer Science, Chemical Engineering, or a closely related field.  

· Minimum 5 years of hands-on industrial R&D experience in electronic materials, specifically within electronic packaging.  

· In-depth understanding and knowledge in polymer structure property relationships, polymer filler interaction, adhesion and interface phenomena, rheological property control, polymer and intermediates modification.  

· Comprehensive knowledge in adhesive technology or heat management or packaging for electronic devices.  

· Proven experience in product development and a successful track record of technology transfer and product commercialization.  

· Strong communication skills, English can be used as a working language. 

· Ability to work autonomously, lead technical projects, and provide effective guidance to less experienced team members.  

· Proactive, result-oriented, and comfortable in a dynamic, fast-paced environment.  

· Be willing to travel as needed for customer support, partner meetings, etc.