Unit Process Development Engineer for CMP
onsemi is seeking a Unit Process Development engineer (CMP) for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies. These engineers will need to work with process integration engineering team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery.
These are “hands on” positions. The successful candidates are expected to be able to work independently as well as within teams. They should possess analytical skills to identify problems, the leadership skills to own and drive improvement across all aspects of new technology from feasibility to production ramp.
- Identify the gaps in global operations and be strong team members of unit process development engineers for technology development from feasibility to production ramp.
- Lead the development and optimization of CMP process parameters, design and validate processes for new product development, and troubleshoot process issues to implement effective corrective actions.
- Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices by collaborating with process integration and device engineering team.
- Own process development and qualification through collaboration with process integration engineers and device engineers to successfully qualify and ramp wide band gap products.
- Improve yield and cost through securing wide process window and complete understanding and reduction of process defects as a process owner.
- Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP).
- Bachelor’s degree. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines.
- 0-5 years of experience in semiconductor engineering related field in CMP process.
- Strong understanding of material properties and process behavior.
- Experience in working and leading cross functional teams and remote factories.
- Ability to drive changes.
- Bucheon, Korea as a main work site