| Principal Engineer, Electrical Engineering – Advanced Packaging | — | US > Arizona > Phoenix | Jun 26 |
| Senior Engineer I, Field Service | — | China > Shanghai | Jun 26 |
| Engineer I, Field Service | — | China > Shanghai | Jun 26 |
| Senior Specialist, Production Planning | — | Singapore | Jun 26 |
| Senior Engineer I, Field Service | — | China > Shanghai | Jun 26 |
| Senior Engineer II, Global Product Support | — | Japan > Tokyo | Jun 26 |
| Senior Manager, Sales | — | China > Shanghai | Jun 26 |
| Senior Engineer II, Process Engineering (tALD) | — | South Korea > Hwaseong | Jun 25 |
| Lead II, Program Management | — | South Korea > Hwaseong | Jun 25 |
| Senior Specialist I, Customer Service | — | Taiwan > Hsinchu | Jun 25 |
| Manager I, Field Software | — | South Korea > Hwaseong | Jun 25 |
| Senior Engineer, Field Process | — | US > Oregon > Hillsboro | Jun 25 |
| Solutions Engineer I (AI/ML) | — | Taiwan > Hsinchu | Jun 25 |
| Manager, Field Process - Thin Film (ALD) | — | Taiwan > Kaohsiung | Jun 24 |
| Manager, Field Process - Thin Film (ALD) | — | Taiwan > Taichung | Jun 24 |
| Manager, Field Process - Epitaxy | — | Education fields required | Jun 24 |
| Controller, Business Control | — | US > Arizona > Phoenix | Jun 24 |
| Engineer II, Global Product Management | — | US > Arizona > Chandler | Jun 24 |
| Senior Engineer, Total Product Support | — | Taiwan > Hsinchu | Jun 24 |
| Specialist II, Purchasing | — | South Korea > Hwaseong | Jun 24 |