Mechanical Program Lead Engineer

## The group you’ll be a part of WETS Deposition group at Lam India Global Hardware Technology (LIGHT) is hiring a Mechanical Program Lead Engineer for its product development engineering team. ## The impact you’ll make As a Mechanical Program Lead Engineer, you will lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment. You will drive early feasibility and architecture decisions, execute detailed design and validation, and ensure robust release to manufacturing through disciplined requirements, risk management, and cross-functional execution. This role partners closely with global engineering, program, and supplier teams to deliver reliable, cost-effective, and serviceable hardware for WETS Deposition product development programs. ## What you’ll do * Design and develop substrate holder involving vaccum/mechaical/pneumatic subsystems for WETS NPD tools * Apply engineering first principles to solve structural, thermal and fluid dynamics problems * Design components using plastic and polymer materials for wet and chemical environments * Perform OEM component selection (eg: valves, regulators, fittings, tubing, and sensors) * Own subsystem delivery from concept through qualification and release * Lead or contribute in DoE (design of experiments), FMEA (failure modes & effects analysis), and DFX (design for cost, manufacturability, assembly, reliability, safety, testing, serviceability). * Drive issue resolution using structured problem‑solving methods (5‑Why, Fishbone, Pareto) * Develop, conduct and mentor feasibility studies and test plans to characterize and validate design performance. * Collaborate with CFTs such as Process, Electrical, Product Support, Supply Chain, and Manufacturing teams * Maintain clear documentation of designs, calculations, risks, and decisions ## Who we’re looking for Minimum Qualifications: * Bachelor’s degree in Mechanical Engineering or related field with 8+ years of experience; or Master’s degree with 6+ years’ experience; or equivalent experience. * Excellent communication, both written and verbal, and technical presentation skills. * Highly proficient in 3D CAD tools such as Solid Edge, Siemens NX. * Hands-on experimental and design background coupled with solid engineering skills. * Excellent leadership skills in team planning, strategizing, innovation * Decision making experience to solve problems related to Engineering and Business processes in collaboration with cross functional team in a matrixed organization ## Preferred qualifications * Strong mechanical design fundamentals with hands-on ownership from concept through release for high-reliability hardware. * Expertise selecting materials and finishes for semiconductor environments (metals, ceramics, quartz, polymers, coatings) with contamination and thermal considerations. * Proficiency in engineering analyses: structural/FEA, thermal/heat transfer, stress and vibration, and fluid/gas flow as applicable. * Experience with requirements definition and verification/validation planning at system and subsystem level. * Working knowledge of DoE, FMEA, and DfX (cost, manufacturability, assembly, reliability, safety, testing, and serviceability). * Strong documentation discipline aligned with Lam/SEMI practices, including GD&T and configuration control. * Structured problem-solving experience (RCCA, 8D, 5-Why, Fishbone) with a track record of closing issues with data. * Broad manufacturing knowledge (machining, sheet metal, welding, polymers) and exposure to additive manufacturing. * Strong communication and stakeholder management skills; ability to influence across teams and drive decisions in design/program reviews. ## Our commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together,...