Senior Engineering Technician

## Company: Qualcomm Technologies, Inc. ## Job Area: Engineering Services Group, Engineering Services Group > Engineering Technician General Summary: The Package Process & Technology team is seeking a highly skilled Engineering Technician to support advanced semiconductor package development through hands-on SMT assembly, process optimization, and reliability test preparation. The ideal candidate will possess extensive experience in electronic package assembly, SMT manufacturing processes, soldering, rework, troubleshooting, and laboratory test support. This role requires strong technical execution skills, attention to detail, and the ability to work closely with engineers to support package development, board-level reliability evaluation, and failure analysis activities. Key Responsibilities: •Perform SMT assembly activities including: \- Solder paste printing \- Component placement \- Reflow process setup and monitoring \- Post-reflow inspection •Support development and optimization of SMT process parameters including stencil design, solder paste selection, and reflow profiles. •Execute fine-pitch component soldering and rework on advanced semiconductor package •Document procedures and train team members •Provide real-time observations, identify anomalies, and share insights •Assemble test fixtures and perform hardware modifications required for reliability testing. This is an office based position located in San Diego, CA and is expected to comply with the company's onsite work policy. This is a U.S. based position and is not eligible for visa sponsorship. Minimum Qualifications: • Bachelor's degree. OR Associate's degree and 1+ year of Engineering Technician or related work experience. OR High School Diploma or equivalent and 2+ years of Engineering Technician or related work experience. Physical Requirements: • Frequently transports and installs equipment weighing at least 25 lbs. Preferred Qualifications: •Hands-on experience with: \- SMT assembly processes \- Soldering and rework •Strong mechanical aptitude and attention to detail. •Experience with semiconductor packaging, board level reliability test or mechanical characterization. •Familiarity with metrology and inspection equipment, such as: \- Optical Microscopes & Digital Microscopy \- X‑ray inspection or CT systems •Hands‑on experience with reliability and mechanical test equipment, such as: \- Thermal Cycling Chambers (TC) \- Drop shock test system \- Instron or Universal Testing Machines (UTM) \- High‑speed Data Acquisition (DAQ) Systems •Experience with FA (Failure Analysis) tools, including: \- Cross‑sectioning tools, polishing systems \- Acoustic microscopy (C‑SAM) \- Scanning Electron Microscope (SEM) Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to...